1. Electromigration Modeling at Circuit Layout Level
Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modeling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
2. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades, the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics.
3. Electromigration in ULSI Interconnections
Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections.
4. Simulated Annealing
This book provides the readers with the knowledge of Simulated Annealing and its vast applications in the various branches of engineering. We encourage readers to explore the application of Simulated Annealing in their work for the task of optimization.
5. Theory and Practice of Quality and Reliability Engineering in Asia Industry
This book discusses the application of quality and reliability engineering in Asian industries, and offers information for multinational companies (MNC) looking to transfer some of their operation and manufacturing capabilities to Asia and at the same time maintain high levels of reliability and quality. It is also provides small and medium enterprises (SME) in Asia with insights into producing high-quality and reliable products. It mainly comprises peer-reviewed papers that were presented at the Asian Network for Quality (ANQ) Congress 2014 held in Singapore (August, 2014), which provides a platform for companies, especially those within Asia where rapid changes and growth in manufacturing are taking place, to present their quality and reliability practices. The book presents practical demonstrations of how quality and reliability methodologies can be modified for the unique Asian market, and as such is a valuable resource for students, academics, professionals and practitioners in the field of quality and reliability.
Published Book Chapters
1. Chapter 14 in “Ceramic Integration and Joining Technologies: From Macro to Nanoscale“
This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.
This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
2. Chapter 2 in “Integrated Circuits, Photodiodes and Organic Field Effect Transistors“
This book begins with metamaterials technology, a novel approach for the design of radiofrequency and microwave components and circuits. Since reliability is a key success factor to engineering products today, the different misconceptions in the common reliability practices of integrated circuits manufacturers are presented.