Dr. Cher Ming Tan

Keynote and Invited Talks/Tutorials

Home Keynote and Invited Talks/Tutorials

Tutorials

  1. M. Tan and Y. Liu. “Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system (Tutorial),” in IEEE Int. Electronic Packaging and Technology Conf., 2008.
  2. M. Tan. “Physics of electromigration in today ULSI interconnections (Tutorial),” in Taiwan ESD and Reliability Conf., Hsinchu, Taiwan, 5-7th Nov. 2012.
  3. Cher Ming Tan, “Statistical Analysis of Reliability Test Data”, one day workshop– Characterization, Modeling and Reliability Issues on Nano Materials and Devices, Chennai, India, 2nd March, 2016.
  4. Cher Ming Tan, “Introduction to Reliability (Tutorial),” in IEEE 23rd International Symposium on the Physical and Failure Analysis of Intergrated Circuits, Marina Bay Sands, Singapore, 18-21 July, 2016.
  5. Cher Ming Tan, “Statistical Analysis of Reliability Test Data (Tutorial),” in 2016 Taiwan ESD and Reliability Conference (TESDC-2016), Hsin Chu, Taiwan, Oct. 31-Nov. 2, 2016.
  6. Cher Ming Tan, “Applications of finite element modeling in Reliability Studies (Tutorial)”, in 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017), Cheng Du, China, 4-7 July, 2017.
  7. Cher Ming Tan, “Failure Analysis in Semiconductor Package Assembly”, in Electronic Packaging Convention (EPCON), Penang, Malaysia, 7th-9th August 2018.

Keynote Talks

  1. Cher Ming Tan, “Reliability Data Analysis (Keynote)”, IEEE Invited talk organized by Rel/CPMT/ED chapter, 2002.
  2. M. Tan. “Electromigration in ULSI Interconnection (Keynote),” in 1st Microreliability and Nanoreliability Congress, Germany, 2007.
  3. M. Tan, M. D. Le, and F. Leng. “SoC and SoH Estimation of battery cell and modules for electric vehicles (Keynote),” in IEEE Annual PHM Conf., Beijing, China, 22nd-24th May 2012.
  4. Cher Ming Tan, “Li Ion Battery Pack Reliability Assurance(Keynote)”, in 4th International Symposium on Energy Challenges and Mechanics, Scotland, UK, 11-13 August, 2015.
  5. Cher Ming Tan, Udit Narula, Dipesh Kapoor, “Reliability Paradox of Automotive Electronics(Keynote)”, International Conference on Electrical, Electronics, and Optimization Techniques 2016(ICEEOT 2016), Chennai, India, 3rd-5th March, 2016.
  6. Cher Ming Tan, “Applications of Finite Element Modeling in Reliability Studies(Keynote)“, in 2nd International Conference on Intelligent Communication, Control and Devices (ICICCD), Dehradun, India, 15-16th April, 2017.
  7. Cher Ming Tan, “Reliability in IoT Era (Keynote)“, 2nd International Conference on Telecommunication and Networks (TEL-NET), Delhi, India, 10-11th August 2017.
  8. Cher Ming Tan, “Reliability of Solder Interconnect (Keynote)”, Singapore Symposium on Interconnect Reliability(SSIR) 2017, Singapore, 25-26 September, 2017.
  9. Cher Ming Tan, “Changing Degradation Mechanisms in Silicon Integrated Circuits (Keynote)”, 7th Annual World Congress of NanoScience & Technology 2017, Fukuoka, Japan, 24th-26th, 2017.
  10. Cher Ming Tan, “Necessity for quantitative reliability evaluation”, International Symposium on Failure, Reliability & Integrity of Engineering Systems, Dehradun, Uttarakhand, India, 8 September, 2018.
  11. Cher Ming Tan, “Necessity for quantitative reliability evaluation for engineering systems”, Workshop on Life Cycle Reliability of Engineering Systems, Jorhat, Assam, India, 22-23rd April 2019.
  12. Cher Ming Tan, “Necessity of quantitative reliability evaluation”, 1st International Conference on Ubiquitous and Emerging Concepts on Sensors & Transducers, Kolkata, India, 25-27th April, 2019.
  13. Cher Ming Tan, “Use of Graphene to overcome the bottleneck in VLSI Interconnections”, 29th Assembly of Advanced Materials Congress (29th AMC – 2019), Sweden, 9-11th October 2019.

Invited Talk

  1. M. Tan and G. Zhang. “Investigation of the physical processes during electromigration of ULSI interconnection (Invited),” in ANSYS User Meeting, 2003.
  1. East China Normal University, China, “Low temperature Wafer bonding (Invited)”, 2003.
  2. Fudan University, China, “Reliability Data Analysis (Invited)”, 2003.
  3. Cher Ming Tan, “Methodology for Build-in Reliability(Invited)”, Invited workshop in International Quality and Process Control Conference, Bangkok, Thailand, Jan 2004.
  4. M. Tan, B. K. Khoo, and J, Png. “Determining maintenance strategy from root cause analysis and reliability data analysis (Invited),” presented at Annual Reliability, Availability, Maintainability and Safety Conf., Kuala Lumpur, Jun. 2004.
  5. M. Tan, B. K. Khoo. “Application of FMEA for build-in reliability and maintenance (Invited),” presented at Industrial Talk, 2004.
  6. M. Tan. “Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (Invited),” presented in International Quality and Process Control Conference, Bangkok, Jan. 2004.
  7. M. Tan. “Reliabiilty Analysis and Application with MATLAB (Invited),” presented at Industrial seminar, May 2004.
  8. M. Tan. “Maintenance policy for predictive maintenance (Invited),” presented at 6th Annual Plant Reliability and Maintenance, Kuala Lumpur, Dec. 2005.
  9. M. Tan. “Predictive maintenance and its impact to business decision (Invited),” presented at Strategic Maintenance Congress, Dec. 2005.
  10. M. Tan. “Is electron wind force the sole driving force in electromingration of ULSI interconnection? (Invited)” in Int. Conf. on Materials for Advanced Technologies, 2005.
  11. M. Tan. “ULSI Interconnect Reliability (Invited)”, invited talk in the Workshop on Technology of Si-based Nanodevices, Singapore 2006.
  12. M. Tan and W. Li. “A holistic numerical modeling for interconnect electromigration (Invited),” presented at Int. Materials Research Society Conf., Chongqing, China, Jun. 2008.
  13. M. Tan. “Finite element modeling for Interconnect Reliability Study (Invited)”, in 7th ASEAN ANSYS Conference, Singapore 2008.
  14. M. Tan and F. He. “3D circuit model for 3D IC reliability study (Invited),” in 10th International Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSIME), 2009.
  15. M. Tan. “Solid State Lighting Reliability (Invited)”, invited talk in Industry Event on Solid State Lighting organized by A*Star 2009 (only NTU speaker).
  16. M. Tan. “TSV Reliability (Invited)” invited talk in IME Industry Forum, 2009.
  17. M. Tan. “Product Excellence in Global Competitive Market (Invited)”, in SQI/SPA Symposium, Singapore 2009.
  18. M. Tan, B. K. Chen, and M. Xiong. “Study of humidity reliability of high power LEDS (Invited),” in IEEE Int. Conf. on Solid-State and Integrated Circuit Technology, Shanghai, 2010, pp. 1592-1595.
  19. Cher Ming Tan, “New Driving Forces in ULSI Electromigration and its implication to IC Designers(Invited)”, in San Jose, USA 2010.
  20. Li and C. M. Tan. “Black’s equation for today’s ULSI interconnect electromigration (Invited),” in Proc. of IEEE Electron Devices and Solid State Circuits, China, 2011.
  21. M. Tan, C. Baudot, Y. D. Han, and H. Jing. “Applications of multi-walled carbon nanotube (Invited),” in IEEE Int. Nanoelectronics Conf., Taiwan, Jun. 2011.
  22. M. Tan, Z. Gan, and W. Li. “Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited),” presented at Int. Conf. on Materials for Advanced Technologies, Singapore, Jul. 2011.
  23. M. Tan, M. D. Le, and F. Leng. “Estimation of SoC/SoH of cell and RUL of battery pack for EV Application (Invited),” in IEEE Battery Management Systems for High Operational Availability and Safety Conf., Shenzhen, China, 21st May 2012.
  24. M. Tan and C. Fu. “Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited),” in Proc. of IEEE ICSICT, Xi’an, China, 29th Oct. – 1st Nov. 2012.
  25. M. Tan. “Recent Development of Reliability and Maintenance (Invited),” in TUV SÜD PSB Testing, Inspection and Certification Conf., Singapore, Sep. 2012.
  26. M. Tan and F. He. “3D electromigration modeling at circuit level (Invited),” in Taiwan ESD and Reliability Conf., Hsinchu, Taiwan, 5-7th Nov. 2012.
  27. M. Tan. “Study of humidity reliability of solid state lighting (Invited),” in LED Display and Lighting System Symp., Shenzhen, China, 18-19th Jul. 2012.
  28. Cher Ming Tan, Shuai Zhang, Feifei He, Xi Zhu and Haibin Su, “Model the Physics of Micro-crack formation in Alumimum under high temperature cycling (Invited)”, in International Conference on Small Science, Las Vegas, USA, 2013.
  29. Cher Ming Tan and Xiangchen Chen, “ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device (Invited)”, in Collaborative Conference on Materials Research, Korea 2013.
  30. Cher Ming Tan, “Extending electromigration modeling from test structures to Integrated circuit layout level (Invited)”, in International Reliability Physics Symposium, 2014, USA.
  31. Cher Ming Tan and Preetpal Singh, “Reliability Lifetime Extrapolation of high power LEDs under humidity test – A revisit (Invited)”, in 2014 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), Chengdu, China, 2014.
  32. Cher Ming Tan, “Product Reliability Assurance – The manifestation of the Core Values of Chinese Culture (Invited)”, in 2nd Chinese Quality Forum, Hong Kong, 2014.
  33. Cher Ming Tan and Udit Narula, “Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test(Invited)”, in 2014 IEEE International Conference on Solid State and Integrated Circuits Technology, Guilin, China.
  34. Feng Leng and Cher Ming Tan, “A methodology for studying the effect of overcharge on the safety of lithium-ion batteries (Invited)”, in 5th Annual Battery Safety Conference, Washington, USA, 2014.
  35. Cher Ming Tan and Preetpal Singh, “Exploring the Humidity Effect on the Reliability of High Power LEDs (Invited)”, in International Electron Devices and Materials Symposium, Hualian, Taiwan, November, 2014.
  36. Cher Ming Tan and Feng Leng, “Internal probing into the degradation processes in Lithiumion batteries under cyclic aging (Invited)”, The 1st International battery Safety Workshop, Munich, Germany, 25-26 August, 2015.
  37. Udit Narula, Chao Sung Lai, Cher Ming Tan, “Determination of Key Factors for Low Temperature Graphene Synthesis using Design of Experiments Approach (Invited),” in 7th IEEE International Nanoelectronics Conference, Chengdu, China, 9-11 May, 2016.
  38. Cher Ming Tan, “Effect of ULSI Interconnect layout on its electromagnetic emission (Invited),” in International Conference on Solid-State and Integrated Circuit Technology, Hangzhou, China, 25-28 Oct., 2016.
  39. Cher Ming Tan, “ULSI Interconnection electromigration and its EMI performance (Invited),” in IEEE International Microwave, Electron Devices, Solid-State Circuit Symposium(IMESS2016), Penang, Malaysia, 9-10 Nov., 2016.
  40. Cher Ming Tan, “Degradation Physics of High Power LEDs in Outdoor Applications (Invited),” in 13th China International Forum on Solid State Lighting (SSL CHINA 2016), Beijing, China, 15-17 Nov., 2016.
  41. Cher Ming Tan, “Applications of Finite Element Modelling in Reliability (Invited)“, Symposium on Reliability of Semiconductors and Packaging Testing, Hsinchu, Taiwan, 10th February, 2017.
  42. M. Tan, “Non destructive examination of Li Ion Battery (Invited)“, International Battery Safety Workshop, New Mexico, USA, 9-10th May, 2017.
  43. Cher Ming Tan, “Finite element analysis for the understanding of physics of failure in Microelectronics (Invited)”, 2017 IEEE Electron Devices Mini-Colloquium, Chengdu, China, 3rd July, 2017.
  44. Cher Ming Tan, Preetpal Singh, Wenyu Zhao and Hao-Chung Kuo, “Limitations of Phosphor layer thickness and Drive Current for White LEDs (Invited)“, Pacific Rim Conference on Lasers and Electro-Optics (CLEO-Pacific Rim), 22nd OptoElectronics and Communications Conference (OECC) and 5th Photonics Global Conference (PGC), Singapore, 31st July-4th August, 2017.
  45. Cher Ming Tan, “Practicality and Importance of Advanced Reliability Technology to Industry (Invited)“, Reliability & Failure Analysis Technology Seminar, Taiwan, 23rd August 2017.
  46. Cher Ming Tan, “Necessity of Quantitative Reliability Evaluation (Invited)“, Cadmen CAE applications Annual Meeting, Taiwan, 31st October 2017.
  47. Cher Ming Tan, “Necessity of Quantitative Reliability Evaluation (Invited)”, 第二屆全球華人品質峰會, Danshui, Taiwan, 16th-17th 2017.
  48. Cher Ming Tan, “Interconnect Reliability Assurance through Electrical Testing (Invited)”, 19th Electronics Packaging Technology Conference (EPTC 2017), Singapore, 6th-9th 2017.
  49. Cher Ming Tan, “A novel interconnect material for the challenges in high speed and high reliability chips(Invited)”, 2017 IEEE Electrical Design for Advanced Packaging Symposium, Hangzhou, China, 14-16th 2017.
  50. Cher Ming Tan, “Realistic DfR in digital age for electronics”, 2018 World Conference on Quality and Improvement, Seattle USA, 30 Apr – May2, 2018.
  51. Cher Ming Tan, “New Driving force for electromigration in today VLSI Interconnections”,  EDS-Distinguished Lecture at IIT Kanpur, Uttar Pradesh, India, 5th September, 2018.
  52. Cher Ming Tan, “An illustration of predictive maintenance on medical instruments using haemodialysis machines”, 16th ANQ Congress 2018, Almaty, Kazakhstan, 19-20 September 2018
  53. Cher Ming Tan, “Degradation mechanism for CdSe quantum dot down converted LEDs”, 14th International Conference on Solid-State and Integrated Circuit Technology, Qingdao, China, 31 Oct – 3 Nov, 2018.
  54. Cher Ming Tan, “Identification of Electromagnetic Hot spot in Integrated Circuit” 6th International Conference on Signal Processing and Integrated Networks (SPIN 2019), Noida, Uttar Pradesh, India, 7 – 8 March 2019.
  55. Cher Ming Tan, “Product Excellence in Global Competitive Market”, Zhejiang University, Hangzhou, China, 9 April 2019.
  56. Cher Ming Tan, “Why things fails and why do we bother about it”, Workshop on Life Cycle Reliability of Engineering Systems, Jorhat, Assam, India, 22-23rd April 2019.
  57. Cher Ming Tan, “Quality Method for Product Reliability Assurance”, International Industrial Reliability Workshop (IIRW), Taoyuan, Taiwan, 30th April 2019.
  58. Cher Ming Tan, “Reliability Challenges of Nano-Interconnects”, IEEE EDS Mini Colloquium (MQ) on Emerging Nanoscale Devices: Compact Modeling and Reliability, Roorkee, Uttarakhand, India, 4th May 2019.
  59. Cher Ming Tan, “High Power LED Packaging Reliability-an Overview”, International Congress on Advanced Materials, Sciences and Engineering, Osaka, Japan, 22-24th July, 2019.
  60. Cher Ming Tan, “Principle of failure rate computation in IEC standards and limitations”, Taoyuan, Taiwan, 5th Sep, 2019.
  61. Cher Ming Tan, “Fundamental principle in reliability prediction”, Taoyuan, Taiwan, 5th Sep, 2019.
  62. Cher Ming Tan, “Ensure product reliability beyond IEC standards”, Taoyuan, Taiwan, 5th Sep, 2019.
  63. Cher Ming Tan, “Battery and component reliability evaluation method”, Tainan, Taiwan, 10th Sep, 2019.
  64. Cher Ming Tan, “Applications of Finite Element Analysis for Product Reliability Evaluation”, New Taipei City, Taiwan, 4th Oct, 2019.
  65. Cher Ming Tan, “Applications of Finite Element Analysis for Product Reliability Evaluation” Kaohsiung, Taiwan, 16th Oct, 2019.