| S.No. | Research Area | Journal Papers | Conference Papers | Total papers | Invited Talks | Tutorials | Keynote Speech |
| 1 | Interconnect Reliability* | 46 | 45 | 91 | 9 | 2 | 1 |
| 2 | Nanotechnology | 20 | 20 | 40 | 2 | 0 | 1 |
| 3 | Devices Reliability | 15 | 11 | 26 | 0 | 0 | 0 |
| 4 | Prognosis and Health Mgmt./ Predictive Maintenance | 6 | 15 | 21 | 7 | 0 | 1 |
| 5 | Wafer Bonding | 7 | 12 | 19 | 2 | 0 | 0 |
| 6 | Integrated Circuit Reliability | 7 | 8 | 15 | 2 | 1 | 0 |
| 7 | Failure Analysis | 7 | 6 | 13 | 0 | 0 | 0 |
| 8 | Reliability Statistics | 3 | 9 | 12 | 5 | 0 | 1 |
| 9 | LED Reliability | 14 | 11 | 25 | 4 | 0 | 0 |
| 10 | Quality | 2 | 6 | 8 | 1 | 0 | 0 |
| 11 | Battery | 3 | 4 | 7 | 2 | 0 | 2 |
| 12 | Remanufacturing | 1 | 1 | 2 | 0 | 0 | 0 |
| 13 | General Reliability | 0 | 1 | 1 | 1 | 2 | 0 |
| 14 | Others | 11 | 18 | 29 | 8 | 0 | 0 |
| TOTAL | 142 | 167 | 309 | 43 | 5 | 6 |
*Interconnect includes ULSI Interconnects, TSV, Solders and wire bonding