Addressing the challenges in solder resistance measurement for electromigration test

Y. C. Tan, C. M. Tan, and T. C. Ng, “Addressing the challenges in solder resistance measurement for electromigration test,” Microelectronics Reliability, vol. 50, pp. 1352-1354, 2010
https://www.sciencedirect.com/science/article/pii/S0026271410003240

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