Statistical Method and Non-Destructive Analytical Tools in the Failure Analysis of LED Array

When several units failed during operation or reliability test, and their failure modes are the same, it is difficult to examine if there are multiple failure mechanisms unless destructive analysis is performed on every units. However, this can be very time and resource consuming. This work demonstrates a method that combine statistical method and non-destructive …

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Graphene and VLSI Interconnects

Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it is approaching its limits with respect to electrical performance and reliability. Graphene is a non-metal material, but it can help to improve …

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