Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects CONFERENCE PAPERS
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test CONFERENCE PAPERS
Investigation of the physical processes during electromigration of ULSI interconnection (invited) CONFERENCE PAPERS
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects CONFERENCE PAPERS
Overcoming intrinsic weakness of ULSI metallization on electromigration performances CONFERENCE PAPERS