Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structuresCONFERENCE PAPERS
Integrating device modeling in QFD implementation for power electronics applicationsCONFERENCE PAPERS
Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT)CONFERENCE PAPERS
Selection of failure time within test time interval for group reliability data analysisCONFERENCE PAPERS
