Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability EvaluationCONFERENCE PAPERS
Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration testCONFERENCE PAPERS
Extending electromigration modeling from test structures to Integrated circuit layout levelCONFERENCE PAPERS
Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cyclingJOURNAL PAPERS
Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress ReliefJOURNAL PAPERS
Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk)CONFERENCE PAPERS
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delayCONFERENCE PAPERS
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage currentCONFERENCE PAPERS
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder JointsJOURNAL PAPERS