Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation CONFERENCE PAPERS
Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test CONFERENCE PAPERS
Extending electromigration modeling from test structures to Integrated circuit layout level CONFERENCE PAPERS
Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling JOURNAL PAPERS
Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief JOURNAL PAPERS
Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk) CONFERENCE PAPERS
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay CONFERENCE PAPERS
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current CONFERENCE PAPERS
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints JOURNAL PAPERS