Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited Talk) CONFERENCE PAPERS
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects JOURNAL PAPERS
Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes CONFERENCE PAPERS
Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes CONFERENCE PAPERS